BGA Test & Technology specializes in modifying and testing electronic components, with particular expertise in retinning and reballing for military, aerospace, and other high-reliability applications. Based in Holbrook, New York, the company uses robotic solder-dip and reballing processes to deliver repeatable component work, including conversions between leaded and lead-free solder systems. Its quality system is certified to AS9100D, ANSI/ESD-S20.20:2021, and NADCAP standards, and the company is CMMC Level 2 certified and ITAR registered.
AS9100D
ANSI/ESD-S20.20:2021
NADCAP
CMMC-LEV2
Compliance program
ITAR Registered
Registration
Cage Code: 6EMC9
Registration
CMMC Level 2
Cybersecurity certification
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