Since 2000, first level inc. has built microelectronic packages and assemblies for customers taking devices from design through prototype to production. The York, Pennsylvania contract assembly facility centers its work on direct chip attach and chip-on-board, using 5,500 square feet of clean-room manufacturing space and both manual and automated equipment. Its engineers and technicians support demanding applications ranging from medical electronics to aerospace, with in-house tooling design and fabrication adding flexibility during process development.
ITAR Registered
Registration
J-STD-001
IPC-A-610