Rochester-based Mosaic Microsystems develops thin-glass packaging solutions that connect microelectronic and photonic chips, using its proprietary VIAFFIRM® bonding technology to make fragile glass workable in semiconductor manufacturing. Co-founder Shelby F. Nelson’s glass-packaging work earned her the 2024 Entrepreneur of the Year award from the Rochester Section of the American Chemical Society, while the company’s technology has also received a $1 million Defense Business Accelerator award. Mosaic operates offices and clean-room manufacturing space in Rochester and has demonstrated its temporary-bond process on 300 mm wafers.
SBIR Phase II award from the National Science Foundation
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SBIR and STTR awards
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