Rochester-based Photonect develops laser-fusion technology and equipment for attaching optical fibers to photonic chips without epoxy. Its patented oxide mode converters and glass-to-glass fusion process are used in fiber-attach services and the PIX-Attach system, designed for research and scalable manufacturing. The company says its process delivers low-loss connections in under a minute, while PIX-Attach supports throughput of up to 60 units per hour with active alignment.
NSF Technology Enhancement for Commercial Partnerships (TECP)
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